Hi-Fix board, Load Board (SOC Type Mother Board)
Build Up Board/Proto type Board
Probe Card
Burn In Board
Build Up Board/Proto type Board
Untitled Document
Ace Tech Circuit > Products > Burn In Board (BIB)


This board is DUT (Device under Test) Board as using in ¡®Burn in Test¡¯. There are many sockets on the board to test the semiconductors. (Burn in Test is the test for the device on the Burn In Board with unfavorable conditions (temperature, Voltage and so on) to detect the fail out and to evaluate the feature of the product.)


Specification
Unit
mm
inch
Layer
4~22
4~22
Base Material
FR-4, polyimide,
FR-4 High Tg,
BT-Resin
FR-4, polyimide,
FR-4 High Tg,
BT-Resin
Min. Thickness
0.3~2.4
0.012~0.096
Conductor Width
0.075
0.003
Conductor Space
0.075
0.003
Hole Diameter
©ª 0.15
©ª 0.006
Surface Treatment
(Gold Fingers & Electroless Gold Plating)
1.3¥́m
50¥́¡±
Pitch
0.4
0.016