|
Specification |
|
Unit
|
|
|
|
|
|
mm |
|
inch
|
|
|
|
|
|
Layer |
|
100(+) |
|
100(+) |
|
Base Material |
|
FR-4
Low Dk
FR-4 High Tg |
|
FR-4
Low Dk
FR-4 High Tg |
|
Min. Thickness
|
|
1.6-8.4 |
|
0.063~0.33 |
|
Conductor Width
|
|
0.045 |
|
0.0018 |
|
Conductor Space
|
|
0.06 |
|
0.0024 |
|
Hole Diameter
|
|
¥Õ 0.076 |
|
¥Õ 0.003 |
|
Surface
Treatment
(Hard Gold & Electroless Gold Plating) |
|
1.3¥ìm |
|
50¥ì¡± |
|
Pitch
|
|
0.2 |
|
0.008 |
|
Etc
|
|
HPL,
Back Drill |
|
|
|
|
- 68 Layers
- 6.5T
- IVH
- 0.4 Pitch |
|