Untitled Document
Ace Tech Circuit > Manufacturing >
Capability
Item
Standard
Advanced
Emerging
Material
FR-4, High-Tg FR-4,
Polyimide,
Low Dk, BT-Resin
FR-4, High-Tg FR-4,
Polyimide,
Low Dk, BT-Resin, PTFE
FR-4, High-Tg FR-4,
Polyimide,
Low Dk, BT-Resin, PTFE
Impedance Control
10%
8%
5%
"Pattern
Width"
Inner Layer
0.003"
0.075mm
0.0024"
0.06mm
0.0016"
0.04mm
Outer Layer
0.0036"
0.09mm
0.0028"
0.07mm
0.0024"
0.06mm
Drill to Copper
13.4" x16"
0.0035"
0.089mm
0.0026"
0.065mm
0.0020"
0.05mm
16"x20"
0.0035"
0.089mm
0.0028"
0.07mm
0.0024"
0.06mm
20"x24"
0.004"
0.1mm
0.0028"
0.07mm
0.0026"
0.065mm
13.4"x26"
0.004"
0.1mm
0.003"
0.075mm
0.0026"
0.065mm
BGA pitch
0.016"
0.4mm
0.012"
0.3mm
0.08"
0.2mm
Immersion Gold
1.2¥ì"
0.03¥ìm
20µ"
0.5µm
50µ"
1.27µm
Electrolytic Hard Gold
20¥ì"
0.5¥ìm
50µ"
1.27µm
60µ"
1.5µm
Max. Number of Layers
60
80
100+
Min. Hole Size
0.006"
0.15mm
0.005"
0.125mm
0.003"
0.075mm
Max. Panel size
24.0"x26.0"
610x660mm
24.4"x28.3"
620x720mm
24.4"x28.3"
620x720mm
Max. Board Thickness
0.189"
4.8mm
0.283"
7.2mm
0.33" +
8.4mm +
"Max. Aspect Ratio on
0.248" thickness"
26 : 1
33 : 1
42 : 1 +
"Max. Aspect Ratio on
0.197" thickness"
14 : 1
25 : 1
33 : 1
Registration
13.4" x16"
0.003"
0.075mm
0.0016"
0.04mm
0.0012"
0.03mm
16"x20"
0.003"
0.075mm
0.0016"
0.04mm
0.0012"
0.03mm
20"x24"
0.003"
0.075mm
0.002"
0.05mm
0.0016"
0.04mm
13.4"x26"
0.003"
0.075mm
0.002"
0.05mm
0.0016"
0.04mm
Others
Plugging, Back Drill
Plugging, Back Drill
Plugging, Back Drill
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Build-up
Build-up (Via Fill)
