Untitled Document
Ace Tech Circuit > Manufacturing > Capability

Item
Standard
Advanced
Emerging
Material
FR-4, High-Tg FR-4,
Polyimide,
PPE, BT-Resin
FR-4, High-Tg FR-4,
Polyimide,
PPE, BT-Resin, PTFE
FR-4, High-Tg FR-4,
Polyimide,
PPE, BT-Resin, PTFE
Impedance Control
10%
8%
5%
"Pattern
Width"
Inner Layer
0.003"
0.075mm
0.002"
0.05mm
0.002"
0.05mm
Outer Layer
0.0036"
0.090mm
0.0028"
0.07mm
0.0024"
0.06mm
Drill to Copper
13.4" x16"
0.0035"
0.089mm
0.003"
0.075mm
0.0028"
0.070mm
16"x20"
0.0035"
0.089mm
0.003"
0.075mm
0.0028"
0.070mm
20"x24"
0.0040"
0.100mm
0.003"
0.075mm
0.0028"
0.070mm
13.4"x26"
0.0040"
0.100mm
0.003"
0.075mm
0.0028"
0.070mm
BGA pitch
0.02"
0.5mm
0.014"
0.35mm
0.012"
0.30mm
Immersion Gold
1.2"
0.03m
12µ"
0.3µm
12µ"
0.3µm
Electrolytic Hard Gold
20"
0.5m
60µ"
1.5µm
60µ"
1.5µm
Max. Number of Layers
48
72
74+
Min. Hole Size
0.008"
0.2mm
0.004"
0.10mm
0.004"
0.10mm
Max. Panel size
24.0"x26.0"
610x660mm
24.4"x28.8"
610x720mm
24"x28.3"
610x720mm
Max. Board Thickness
0.189"
4.8mm
0.288"
7.2mm
0.291" +
7.4mm +
"Max. Aspect Ratio on
0.248" thickness"
12 : 1
26 : 1
32 : 1
"Max. Aspect Ratio on
0.197" thickness"
14 : 1
25 : 1
33 : 1
Registration
13.4" x16"
0.003"
0.075mm
0.0020"
0.050mm
0.0020"
0.050mm
16"x20"
0.003"
0.075mm
0.0020"
0.050mm
0.0020"
0.050mm
20"x24"
0.003"
0.075mm
0.0025"
0.063mm
0.0025"
0.063mm
13.4"x26"
0.003"
0.075mm
0.0025"
0.063mm
0.0025"
0.063mm
Others
Plugging, Back Drill
Plugging, Back Drill
Plugging, Back Drill
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Build-up
Build-up