Untitled Document
Ace Tech Circuit > Manufacturing >
Capability
Item
2016
Material
FR-4, High-Tg FR-4, Polyimide, PPE, BT-Resin, PTFE
Impedance Control *1)
5%
"Pattern
Width"
Inner Layer
0.0020"
0.050mm
Outer Layer
0.0025"
0.063mm
Drill to Copper
13.4" x16"
0.0025"
0.063mm
16"x20"
0.0025"
0.063mm
20"x24"
0.0028"
0.070mm
13.4"x26"
0.0028"
0.070mm
BGA pitch *2)
0.010"
0.25mm
Immersion Gold
20¥ì"
0.5¥ìm
Electrolytic Hard Gold
60¥ì"
1.5¥ìm
Max. Number of Layers
-
Min. Hole Size
0.003"
0.075mm
Max. Panel size
24.4"x28.8"
610x720mm
Max. Board Thickness
0.305"
8.0mm
"Max. Aspect Ratio on
0.248"" thickness"
32 : 1
"Max. Aspect Ratio on
0.197"" thickness *3)"
33 : 1
Registration
13.4" x16"
0.0020"
0.050mm
16"x20"
0.0020"
0.050mm
20"x24"
0.0023"
0.058mm
13.4"x26"
0.0023"
0.058mm
Others
Plugging, Back Drill
Build-up
